Cored Wires
No clean, RMA and RA resin based wires, organic cored wires for mechanical joints in all the main lead free alloys (SAC, SnCu, SnAg, Sn100C) and traditional ones.
Lead Free
Resin/Rosin based
Mild activation, fast joints. Halide free, with light amber residues. Compliant to DIN EN 29454.1,1.1.3.B and to IPC J STD-004B: ROL1.
Mild activation, fast joints. Halide free, with light amber residues. Compliant to DIN EN 29454.1,1.1.3.B and to IPC J STD-004B : ROL1.
Activated rosin based, allows good wetability with lead-free alloys. Compliant to DIN EN 29454.1,1.1.2B and to IPC J STD-004B: ROM1.
Mild activation, fast joints. Halide free, with light amber residues. Compliant to DIN EN 29454.1,1.1.3.B and to IPC J STD-004B: ROL1.
Mild activation, fast joints. Halide free, with light amber residues. Compliant to DIN EN 29454.1,1.1.3.B and to IPC J STD-004B : ROL1.
Activated rosin based, allows good wetability with lead-free alloys. Compliant to DIN EN 29454.1,1.1.2B and to IPC J STD-004B: ROM1.
No Clean
Last generation no clean flux cored wire, compatible to all AIM products. Compliant to IPC J-STD-004B RELO. SN100C®, SAC305 and SAC0307 available.
Last generation no clean flux cored wire, compatible to all AIM products. Compliant to IPC J-STD-004B RELO. SN100C®, SAC305 and SAC0307 available.
Other
Organic based flux, good activation for structural joints. Cleaning of the residues is strongly recommended when used in electrical joints. Compliant to DIN EN 29454.1,3.1.1.C IPC J STD-004B ORH1.
Organic based flux, good activation for structural joints. Cleaning of the residues is strongly recommended when used in electrical joints. Compliant to DIN EN 29454.1,3.1.1.C IPC J STD-004B ORH1.
With Lead
Resin/Rosin based
RA activation, allows fast joints even with hard-to-solder surfaces. Compliant to DIN EN 29454.1,1.1.2.B and to IPC J STD-004B : ROM1.
RMA, ideal in electronic joints, with safe and amber, electrically safe residues. Compliant to EN 2945.1,1.1.3B and to IPC J STD-004B: ROL1.
RMA, ideal in electronic joints, with safe and amber, electrically safe residues. Compliant to EN 2945.1,1.1.3B and to IPC J STD-004B: ROL1.
RA activation, allows fast joints even with hard-to-solder surfaces. Compliant to DIN EN 29454.1,1.1.2.B and to IPC J STD-004B : ROM1.
RMA, ideal in electronic joints, with safe and amber, electrically safe residues. Compliant to EN 2945.1,1.1.3B and to IPC J STD-004B: ROL1.
RMA, ideal in electronic joints, with safe and amber, electrically safe residues. Compliant to EN 2945.1,1.1.3B and to IPC J STD-004B: ROL1.
Other
Developed to allow good strenght sructural joints on copper, brass, bronze and iron. Particularly effective on zinc plated capacitor heads. When exceptionally used in electronic joints, it is absolutely necessary to remove residues after soldering.
Developed to allow good strenght sructural joints on copper, brass, bronze and iron. Particularly effective on zinc plated capacitor heads. When exceptionally used in electronic joints, it is absolutely necessary to remove residues after soldering.