SMD Paste
No clean print and dispense paste for lead-free alloys, including low- and no-silver. Ultra-fine pitch printing, low BTC voiding, excellent pause to print.
Dickmann Srl also supplies AIM's REL61™ and REL22™ lead-free solder alloys that have been specifically engineered as exceptionally durable alloys for extreme service environments. AIM's REL alloys are proven to significantly reduce voiding as well as outperform SAC alloys, making REL the ideal choice for all mission critical electronics applications.
Lead Free
M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.
NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NC257-2 was developed for use in air reflow, but can be used in both N2 and vapor-phase reflow processes as well. NC257-2 is formulated to extend print performance and tack time in facilities where environmental control is not at its optimum.
M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.
NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. NC257-2 produces bright, smooth and shiny solder joints and very clear, low volume post soldering residue. NC257-2 was developed for use in air reflow, but can be used in both N2 and vapor-phase reflow processes as well. NC257-2 is formulated to extend print performance and tack time in facilities where environmental control is not at its optimum.
With Lead
M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.
M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.