Flux
Liquid Fluxes and Paste Fluxes are available in a variety of formulations and packaging. The no clean (alcohol based and VOC free), water soluble and rosin based chemistries of AIM’s fluxes offer a broad range of benefits proven to perform well in a variety of applications.
Alcohol based
FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides fast wetting and PTH barrel fill and reduces common soldering defects such as bridging, flagging and solder balls. FX16 has a durable activation system that can withstand high process temperature required for thermally demanding applications and extended solder contact time.
NC264-5 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. NC264-5 offers faster wetting for SN100C® and SAC alloys than previously formulated fluxes and is compatible with a broad range of lead-free and tin-lead solder alloys. NC264-5 offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC264-5 is designed to be a no clean, non-visible residue flux, which can be cleaned if critical to the product application.
NC266-3 is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to enhance wetting and prevent bridging during the wave soldering process. NC266-3 offers an enhanced activity level, as well as lower surface tension than other no-clean flux chemistries. NC266-3 performs well with bare copper, solder coated and organic coated PWBs, leaving negligible post-process residues that are non-conductive and do not require cleaning. NC266-3 may be utilized with tin-lead and lead-free solder alloys.
FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides fast wetting and PTH barrel fill and reduces common soldering defects such as bridging, flagging and solder balls. FX16 has a durable activation system that can withstand high process temperature required for thermally demanding applications and extended solder contact time.
NC264-5 is an alcohol-based no-clean liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. NC264-5 offers faster wetting for SN100C® and SAC alloys than previously formulated fluxes and is compatible with a broad range of lead-free and tin-lead solder alloys. NC264-5 offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC264-5 is designed to be a no clean, non-visible residue flux, which can be cleaned if critical to the product application.
NC266-3 is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to enhance wetting and prevent bridging during the wave soldering process. NC266-3 offers an enhanced activity level, as well as lower surface tension than other no-clean flux chemistries. NC266-3 performs well with bare copper, solder coated and organic coated PWBs, leaving negligible post-process residues that are non-conductive and do not require cleaning. NC266-3 may be utilized with tin-lead and lead-free solder alloys.
Voc Free
VF12 liquid flux is a water-based VOC-Free flux with exceptional performance and reliability. A medium-solids/residue flux, VF12 offers excellent barrel fill and wetting performance while leaving non-corrosive and non-conductive residue, even without thermal exposure. These properties make VF12 ideal for all applications including selective, wave and hand soldering. VF12 can be used with all common leaded and lead-free solder alloys, as well as AIM REL alloys.
VF12 liquid flux is a water-based VOC-Free flux with exceptional performance and reliability. A medium-solids/residue flux, VF12 offers excellent barrel fill and wetting performance while leaving non-corrosive and non-conductive residue, even without thermal exposure. These properties make VF12 ideal for all applications including selective, wave and hand soldering. VF12 can be used with all common leaded and lead-free solder alloys, as well as AIM REL alloys.
Gel (Paste Flux)
NC258 Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components assemblies, and substrates. AIM NC258 Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.
NC257-2 Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates.
NC Paste Flux is a no clean tacky/rework flux designed for general touch up or rework of printed circuit boards, and for BGA rework and sphere attachment.
NC258 Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components assemblies, and substrates. AIM NC258 Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.
NC257-2 Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates.
NC Paste Flux is a no clean tacky/rework flux designed for general touch up or rework of printed circuit boards, and for BGA rework and sphere attachment.